Introduction
A CNC-machined copper heat sink is a thermal management component made of copper using CNC machining technology. It is used to conduct heat generated by electronic devices or power modules through a solid structure and dissipate it into the external environment.
Specification
|
Product Name |
Heat Sink |
|
Temper |
T3 - T8 |
|
Tolerance |
±0.02mm |
|
Finishing |
Degreasing, Anodizing, Sand Blasting, Painting, Chromating and Laser marking. |
|
Testing Equipment |
Measurement instrument, Projector, CMM, Altimeter, Micrometer, Thread Gages, Calipers, Pin Gauge etc. |
|
Inspection |
100% QC, can provide inspection every batch |
Features
High Thermal Conductivity Materials
Copper has a thermal conductivity of approximately 400 W/m·K, allowing heat to be conducted to all parts of the heat dissipation structure within a shorter path, thus reducing localized heat buildup.
Complex Fin Structure Machining Capable
CNC machining can achieve narrow-pitch, high-density, or irregularly shaped fin structures, thereby altering the heat transfer area and airflow channel distribution per unit volume.
Secondary Surface Treatments
Sandblasting, chemical conversion treatments, or coatings can be applied to meet specific application requirements such as oxidation resistance, electrical insulation, or visual marking.

Applications
Automotive Electronics: Used for heat conduction and dissipation in vehicle control units, power modules, and power devices.
Communication Equipment: Used for heat dissipation structures in base station RF modules, power systems, and network equipment.
Data Centers and Servers: Used for heat dissipation of high heat flux density devices such as CPUs, GPUs, and power modules.
Medical Equipment: Used for temperature control in imaging systems, power components, and precision electronic modules.
Industrial Power and Automation: Used for thermal management in frequency converters, inverters, and power control equipment.
Aerospace and Defense: Used for heat dissipation components in electronic systems where thermal paths and structural space are constrained.
FAQ
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