Aluminum Stacked Fin Heat Sink

Aluminum stacked fin heat sink is a thermal management component formed by cutting, shaping, stacking and fixing multiple thin aluminum sheets (AL 1100) to a base plate. It is used for heat conduction and dissipation in electronic equipment, industrial systems and machinery. 

Quantifiable Stack Height and Quantity

Single fin thickness is 0.3–0.8 mm, with 10–50 fins stacked. The total stack height and quantity can be directly used to calculate the heat dissipation area per unit volume and the air-side thermal resistance.

Continuous Thermal Contact

The base plate thickness can be designed to be 3–6 mm, using brazing or bolting to ensure a continuous heat conduction path from the heat source to the stack.

Controllable Air Channel Size

Flat spacing is 2–5 mm, allowing for precise matching of thermal resistance design based on wind speed or natural convection conditions.

Power Electronics: Used for thermal management of power components such as IGBT modules, rectifiers, and inverters.

Communication Equipment: Used for heat dissipation structures in base stations, power modules, and network equipment.

LED Lighting Systems: Used for heat dissipation in high-power LED lamps, ensuring junction temperatures remain within a controllable range.

Renewable Energy Inverters: Used for heat dissipation in photovoltaic or wind power inverter modules.

Automotive Electronics: Used for thermal management of ECUs, sensors, and onboard control units.

Industrial Control Systems: Used for heat dissipation of PLCs, motor drives, and embedded electronic units.