Copper Stacked Fin Heat Sink

Copper stacked fin heat sinks are formed by cutting, stacking, and fixing C1100 pure copper sheets to a base plate. They are used for heat conduction and dissipation in high-power electronic devices, industrial equipment, and high heat flux density systems. 

High Thermal Conductivity

C1100 pure copper has a thermal conductivity of approximately 390–400 W/m·K, enabling rapid heat transfer from the base plate to the fin surface, accelerating heat dissipation.

Large Surface Area Heat Dissipation Structure

Single fin thickness is 0.5–1.0 mm, with 15–60 fins stacked at a spacing of 2–6 mm, creating numerous fin surfaces in contact with air, directly increasing the heat exchange area.

Continuous Heat Conduction Path

The base plate thickness is 4–6 mm, and the fins are fixed by brazing or welding, ensuring an uninterrupted heat conduction path from the base plate to the fins, reducing localized overheating.

High-Power LED Lighting Systems: Used for heat dissipation in LED lamps, controlling junction temperature and extending light source lifespan.

Power Electronics: Used for thermal management of IGBT modules, power converters, and power rectifier modules.

Computer and Server Processors: Used for heat dissipation of CPUs, GPUs, and high-performance computing modules.

Industrial Control Systems: Used for heat dissipation of PLCs, motor drives, and embedded electronic devices.

Renewable Energy Equipment: Used for high-power modules such as photovoltaic inverters and wind power controllers.

Aerospace and Medical Equipment: Suitable for electronic components with stringent heat dissipation requirements in continuous operating environments.